74th Heidelberg Image Processing Forum

The 74th Heidelberg Image Processing Forum will take place at Dentsply Sirona in Bensheim on March 3, 2020. The focus will be on ‘Machine Learning for 3D Imaging and Modeling’. While 3D imaging is already established in medical applications, it is only now beginning to really develop in industrial applications. Therefore, the forum pursues two goals: Knowledge transfer between medical and industrial image processing and an inventory of learning methods in 3D imaging and analysis.

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https://www.bv-forum.de/74-bildverarbeitungsforum.html

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Figure 1 | By processing a thin-film multilayer stack with photoactive layer sensitive in the infrared range (r.), on top of a Silicon readout circuitry (ROIC), Imec creates an IR-sensitive CMOS imager (l.) that’s compatible with mass manufacturing. (Image: Imec)
Figure 1 | By processing a thin-film multilayer stack with photoactive layer sensitive in the infrared range (r.), on top of a Silicon readout circuitry (ROIC), Imec creates an IR-sensitive CMOS imager (l.) that’s compatible with mass manufacturing. (Image: Imec)
Si-based CMOS imagers to detect SWIR wavelengths above 1µm
Si-based CMOS imagers to detect SWIR wavelengths above 1µm

Thin-film photodetectors Si-based CMOS imagers to detect...

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